Electronic Encapsulation

Silicon powder and LTCC glass powder are commonly used raw materials in the modern electronic packaging material industry. With the excellent performance of acid and alkali corrosion resistance, wear resistance, high insulation, high thermal conductivity, high thermal stability, low expansion coefficient, and low dielectric coefficient, it is widely used in the copper clad laminate industry. With the improvement of surface treatment conditions, their compatibility with resin systems has been improved. Therefore, silicon micropowder and LTCC glass powder are used as fillers to be applied to copper clad laminates, which can not only reduce costs, but also improve certain properties of copper clad laminates. (Such as thermal expansion coefficient, bending strength, dimensional stability, etc.), it is a real functional filler.